BGA Rework

  • BGA Remove and Placement
  • Level Three Pad Repair & Replace damaged BGA pads
  • ECO Wire Add
  • Circuit Trace Repair
  • BGA Reballing - Reattaching solder balls
  • Interposers - Cost effective method for converting lead-free BGA device
  • Double stacked components
  • Ball Grid Array Connectors
  • BGA Inspection X-Ray
  • PBGA (Plastic Ball Grid Array)
  • TBGA (Tape Ball Grid Array)
  • uBGA (Micro BGA)
  • CCGA (Ceramic Column Grid Array)
  • CBGA (Ceramic Ball Grid Array)
  • CPGA (Ceramic Pin Grid Array)
  • QFP (Quad Flat Pack)
  • SOIC (Small Outline Plastic Packages)
  • Lead Free RoHS BGA (Ball Grid Array)

Lead Free To Lead Conversion








Ask the BGA Experts

Lightspeed Manufacturing has long been a recognized leader in providing top-quality Ball Grid Array (BGA) services of all kinds, from assembly to component services (reballing) to rework. Our equipment includes top-of-the line BGA rework systems, and an experienced staff of technicians with in-depth knowledge and experience in BGA technology. Our range of services includes BGA component removal, replacement and salvage; x-ray inspection; circuit pattern design changes at BGA sites; repair of lifted or missing BGA pads; and repair of solder mask at the BGA sites.

We're your best choice for rework, reballing, inspection, ECOs and upgrades, for BGA, CGA, µBGA, and all top-quality BGA services.

Our new CR Technologies CRX 2000 X-ray machine provides exceptional BGA process

development & BGA diagnostic services for our customers.


CR TECHNOLOGY CRX-2000 High Resolution Realtime X-Ray Inspection System

Image Intensifier with high resolution CCD camera, 5 Motion Programmable Manipulator, Shielded Cabinet, Pentium IV Computer with LCD Display